When it comes to ensuring the quality and reliability of electronic components—especially printed circuit boards (PCBs)—IPC standards are the industry benchmark. Whether you’re producing rigid boards, flexible circuits, or high-reliability aerospace electronics, compliance with IPC-6012, IPC-6013, and related specifications is often mandatory.
But how do you actually prove compliance?
One of the most important tools in your compliance arsenal is mechanical cross-sectioning—also known as microsectioning—a technique that allows for direct measurement and inspection of internal PCB features against IPC criteria.
At Cross Section Lab, we help manufacturers, quality teams, and OEMs meet IPC specifications by providing precise cross-sectioning services tailored for IPC inspections.
What Is IPC Compliance Testing?
IPC (Institute for Printed Circuits) standards define manufacturing requirements and acceptance criteria for PCB construction, plating, solder joints, and more.
Key standards include:
- IPC-6012 – Qualification and performance for rigid PCBs
- IPC-6013 – Standards for flexible and rigid-flex boards
- IPC-TM-650 – Test methods (including microsection analysis)
- IPC-A-600 – Acceptability of printed boards (visual standards)
IPC compliance testing is often required:
- During initial product qualification
- For supplier audits
- As part of in-process quality control
- During lot acceptance testing (LAT)
Why Cross-Sectioning Is Essential for IPC Testing
Many IPC criteria cannot be verified through visual or X-ray inspection alone. They require cross-sectioning to expose internal features and confirm key metrics such as:
- Plated through-hole (PTH) wall thickness
- Copper wrap and annular ring width
- Hole barrel fill and voids
- Layer alignment and registration
- Dielectric thickness
- Solder joint profile and intermetallic bonding
Using mechanical cross-sectioning, these internal characteristics can be visually inspected and measured against the exact dimensions and tolerances outlined in IPC specifications.
Common IPC Tests Requiring Cross Sectioning
| Test Type | Related IPC Standard | Cross Section Use |
|---|---|---|
| Plating thickness (Cu, Sn, Ni, Au) | IPC-6012, TM-650 2.2.20 | Measure wall thickness of plated through-holes |
| Annular ring and pad alignment | IPC-600, IPC-6012 | Check pad-to-hole registration and copper wrap |
| Hole fill and void detection | IPC-600, Class 3 | Inspect resin fill, via quality, and any internal voids |
| Solder joint acceptability | IPC-A-610, IPC-TM-650 | Analyze joint profile, intermetallic compound (IMC), and voids |
| Dielectric thickness and layer count | IPC-2221, IPC-6012 | Confirm dielectric stackup and uniformity |
Why Partner with Cross Section Lab for IPC Testing?
At Cross Section Lab, we provide:
- Clean, high-resolution cross-sections for IPC compliance inspection
- Dimensional measurements and documentation aligned with IPC-TM-650 methods
- Support for Class 1, 2, and 3 IPC criteria
- Optional SEM and optical inspection for enhanced detail
- Fast turnaround to meet your audit or production deadlines
Whether you’re qualifying a new PCB supplier or completing lot acceptance testing, our services ensure you meet IPC expectations with confidence and clarity.
Advantages of Outsourcing IPC Cross-Sectioning
- Independent, unbiased results trusted by OEMs and auditors
- Avoid expensive in-house setup and training
- Access to IPC-trained cross-section technicians
- Consistent, repeatable measurements across large volumes
- ISO 9001:2015 certified and ITAR-registered lab for defense and aerospace compliance